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Stock: In Stock
Shipping Method: LCL, AIR, FCL, Express
Description: IC SOC CORTEX-A53 625FCBGA
Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
Category: |
Integrated Circuits (ICs)
Embedded
System On Chip (SoC) |
Base Product Number: |
XAZU3 |
Product Status: |
Active |
Peripherals: |
DMA, WDT |
Primary Attributes: |
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
Series: |
Zynq® UltraScale+™ MPSoC EG |
Package: |
Tray |
Mfr: |
AMD |
Supplier Device Package: |
625-FCBGA (21x21) |
Connectivity: |
CANbus, I²C, SPI, UART/USART, USB |
Operating Temperature: |
-40°C ~ 100°C (TJ) |
Architecture: |
MPU, FPGA |
Package / Case: |
625-BFBGA, FCBGA |
Number of I/O: |
128 |
RAM Size: |
1.8MB |
Speed: |
500MHz, 1.2GHz |
Core Processor: |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: |
- |
Category: |
Integrated Circuits (ICs)
Embedded
System On Chip (SoC) |
Base Product Number: |
XAZU3 |
Product Status: |
Active |
Peripherals: |
DMA, WDT |
Primary Attributes: |
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
Series: |
Zynq® UltraScale+™ MPSoC EG |
Package: |
Tray |
Mfr: |
AMD |
Supplier Device Package: |
625-FCBGA (21x21) |
Connectivity: |
CANbus, I²C, SPI, UART/USART, USB |
Operating Temperature: |
-40°C ~ 100°C (TJ) |
Architecture: |
MPU, FPGA |
Package / Case: |
625-BFBGA, FCBGA |
Number of I/O: |
128 |
RAM Size: |
1.8MB |
Speed: |
500MHz, 1.2GHz |
Core Processor: |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: |
- |
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