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Stock: In Stock
Shipping Method: LCL, AIR, FCL, Express
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
Category: |
Integrated Circuits (ICs)
Embedded
System On Chip (SoC) |
Product Status: |
Active |
Peripherals: |
DDR, DMA, PCIe |
Primary Attributes: |
Versal™ Prime FPGA, 1.2M Logic Cells |
Series: |
Versal™ Prime |
Package: |
Tray |
Mfr: |
AMD |
Supplier Device Package: |
1369-BGA (35x35) |
Connectivity: |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Operating Temperature: |
-40°C ~ 100°C (TJ) |
Architecture: |
MPU, FPGA |
Package / Case: |
1369-BFBGA |
Number of I/O: |
424 |
RAM Size: |
- |
Speed: |
400MHz, 1GHz |
Core Processor: |
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
Flash Size: |
- |
Category: |
Integrated Circuits (ICs)
Embedded
System On Chip (SoC) |
Product Status: |
Active |
Peripherals: |
DDR, DMA, PCIe |
Primary Attributes: |
Versal™ Prime FPGA, 1.2M Logic Cells |
Series: |
Versal™ Prime |
Package: |
Tray |
Mfr: |
AMD |
Supplier Device Package: |
1369-BGA (35x35) |
Connectivity: |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Operating Temperature: |
-40°C ~ 100°C (TJ) |
Architecture: |
MPU, FPGA |
Package / Case: |
1369-BFBGA |
Number of I/O: |
424 |
RAM Size: |
- |
Speed: |
400MHz, 1GHz |
Core Processor: |
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
Flash Size: |
- |
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