제품 상세정보
지불과 운송 용어
Stock: In Stock
Shipping Method: LCL, AIR, FCL, Express
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
Category: |
Integrated Circuits (ICs)
Embedded
System On Chip (SoC) |
Product Status: |
Active |
Peripherals: |
DMA, WDT |
Primary Attributes: |
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
Series: |
Zynq® UltraScale+™ MPSoC EG |
Package: |
Tray |
Mfr: |
AMD |
Supplier Device Package: |
530-FCBGA (16x9.5) |
Connectivity: |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Operating Temperature: |
0°C ~ 100°C (TJ) |
Architecture: |
MPU, FPGA |
Package / Case: |
530-WFBGA, FCBGA |
Number of I/O: |
82 |
RAM Size: |
256KB |
Speed: |
533MHz, 600MHz, 1.333GHz |
Core Processor: |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: |
- |
Category: |
Integrated Circuits (ICs)
Embedded
System On Chip (SoC) |
Product Status: |
Active |
Peripherals: |
DMA, WDT |
Primary Attributes: |
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
Series: |
Zynq® UltraScale+™ MPSoC EG |
Package: |
Tray |
Mfr: |
AMD |
Supplier Device Package: |
530-FCBGA (16x9.5) |
Connectivity: |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Operating Temperature: |
0°C ~ 100°C (TJ) |
Architecture: |
MPU, FPGA |
Package / Case: |
530-WFBGA, FCBGA |
Number of I/O: |
82 |
RAM Size: |
256KB |
Speed: |
533MHz, 600MHz, 1.333GHz |
Core Processor: |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: |
- |
Tags:
